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Ingxoxo Ngokusula Ukukhanya Kwesicwecwe Se-UV

I-wafer yenziwe nge-silicon ehlanzekile (Si). Ngokujwayelekile ihlukaniswe ngokucaciswa okungu-6-intshi, 8-intshi, no-12-intshi, iwafa ikhiqizwa ngokusekelwe kule wafer. Ama-wafer e-silicon alungiselelwe kusuka kuma-semiconductors ahlanzekile ngokusebenzisa izinqubo ezinjengokudonsa ngekristalu nokusika abizwa ngokuthi ama-wafers beca.sebenzisa ziyindilinga. Izakhiwo ezahlukahlukene zesekethe zingacutshungulwa kumawafa e-silicon ukuze zibe yimikhiqizo enezakhiwo ezithile zikagesi. imikhiqizo yesekethe esebenzayo esebenzayo. Ama-wafer adlula ochungechungeni lwezinqubo zokukhiqiza ama-semiconductor ukuze akhe izinhlaka zesekethe ezincane kakhulu, bese ziyasikwa, zipakishwe, futhi zihlolwe zibe ama-chips, asetshenziswa kakhulu kumishini kagesi ehlukahlukene. Izinto zokwakha ze-wafer zihlangabezane neminyaka engaphezu kwengu-60 yokuvela kwezobuchwepheshe kanye nokuthuthukiswa kwezimboni, zakha isimo sezimboni esibuswa i-silicon futhi sengezwe ngezinto ezintsha ze-semiconductor.

Ama-80% omakhalekhukhwini namakhompyutha omhlaba akhiqizwa eChina. I-China ithembele ekuthengisweni kwamanye amazwe ngo-95% wama-chips ayo asebenza kahle kakhulu, ngakho i-China ichitha ama-US$220 wezigidigidi minyaka yonke ukungenisa ama-chips, okuyisilinganiso esiphindwe kabili uwoyela othengwa minyaka yonke waseChina. Yonke imishini nezinto ezisetshenziswayo ezihlobene nemishini ye-photolithography nokukhiqizwa kwe-chip nazo zivinjelwe, njengama-wafers, izinsimbi ezihlanzekile kakhulu, imishini yokufaka, njll.

Namuhla sizokhuluma kafushane ngesimiso sokusulwa kokukhanya kwe-UV kwemishini yama-wafer. Lapho ubhala idatha, kuyadingeka ukufaka inkokhiso esangweni elintantayo ngokusebenzisa i-VPP enamandla amakhulu esangweni, njengoba kuboniswe kumfanekiso ongezansi. Njengoba inkokhiso ejovwe ingenawo amandla okungena odongeni lwamandla efilimu ye-silicon oxide, ingagcina isimo se-quo kuphela, ngakho-ke kufanele sinikeze inkokhiso inani elithile lamandla! Lesi yisikhathi lapho ukukhanya kwe-ultraviolet kuyadingeka.

gcina (1)

Lapho isango elintantayo lithola imisebe ye-ultraviolet, ama-electron asesangweni elintantayo athola amandla e-ultraviolet light quanta, futhi ama-electron aba ama-electron ashisayo anamandla okungena odongeni lwamandla lwefilimu ye-silicon oxide. Njengoba kuboniswe emfanekisweni, ama-electron ashisayo angena efilimu ye-silicon oxide, ageleze aye ku-substrate nesango, futhi abuyele esimweni sokusulwa. Umsebenzi wokusula ungenziwa kuphela ngokuthola imisebe ye-ultraviolet, futhi awukwazi ukusulwa nge-elekthronikhi. Ngamanye amazwi, inani lamabhithi lingashintshwa kuphela ukusuka ku-"1" liye ku-"0", futhi libheke okuphambene. Ayikho enye indlela ngaphandle kokusula konke okuqukethwe kwe-chip.

gcina (2)

Siyazi ukuthi amandla okukhanya ahambisana ngokuphambene nobude beza beza bokukhanya. Ukuze ama-electron abe ama-electron ashisayo futhi ngaleyo ndlela abe namandla okungena efilimu ye-oxide, ukushiswa kokukhanya okunobude obufushane obungamaza, okungukuthi, imisebe ye-ultraviolet, kudingekile kakhulu. Njengoba isikhathi sokusula sincike enanini lama-photon, isikhathi sokusula asikwazi ukufinyezwa ngisho nasemaza amaza amafushane. Ngokuvamile, ukusula kuqala lapho ubude begagasi buba ngu-4000A (400nm). Ngokuyisisekelo ifinyelela ku-saturation cishe ku-3000A. Ngaphansi kuka-3000A, ngisho noma ubude begagasi bumfushane, ngeke kube nomthelela esikhathini sokusula.

Izinga lokusulwa kwe-UV ngokuvamile liwukwamukela imisebe ye-ultraviolet enobude obunembile obungu-253.7nm kanye namandla angu-≥16000 μ W/cm². Umsebenzi wokusula ungaqedwa ngesikhathi sokuchayeka esisukela kumizuzu engama-30 kuye kwamahora ama-3.


Isikhathi sokuthumela: Dec-22-2023